Precision Solder Paste Machine for Industrial 4.0 MES System Compatibility
Introduction
The G9+ Fully Automatic Solder Paste Printer is a high-end machine for SMT high end applications and fulfils the requirements of 03015, 0.25 pitch, high precision and high speed printing processes.
Specification
| Model | G9+ |
| Max PCB Size | 450x340mm |
| Min PCB size | 50x50mm |
| PCB thickness | 0.4-6mm |
| Max board weight | 5kg |
| Transport height | 900±40mm |
| Board edge gap | 2.5mm |
| Board height | 15mm |
| Transport direction | L-R,R-L |
| Transport speed | max 1500mm/s, program control |
| Transport method | One stage |
| WIdth adjustment | automatic |
| I/O interface | SMEMA |
| PCB positioning (support method) | Magnetic pin/support block/manual up-down table |
| PCB clamping system | Patented over the top clamping |
| Side clamping |
| Adsorption function |
| Print snap-off | 0-20mm |
| Print mode | one/twice |
| Print Speed | 10-200mm/sec |
| Print Mode | One /Twice |
| Squeegee Type | Rubber /steel Squeegee Blade(Angle 45°/55°/60°) |
| Print pressure | 0.5-10kg |
| Template fram size | 470*370mm~737*737mm(20-40thickness) |
| Cleaning System | Droops of rain type cleaning system |
| Reinforced vacuum absorption |
| Dry, wet vacuum three modes |
| Back and forth cleaning |
| CCD FOV | 10x8mm |
| Fiducial mark types | Standard Fiducial mark shape |
| Pad |
| Hole |
| Camera system | Look up/down optics structure |
| CCD digital camera |
| Geometry pattern match |
Machine Performance
| Model | G9+ |
| Repeat position accuracy | ±12.5um@6,CPK≥2.0 |
| Print accuracy | ±18um@6,CPK≥2.0 |
| Print cycle time | ＜7.5 sec |
| Based on the third party test system(CTQ) verify the actual solder paste printing position repeat precision |
Whole Machine Specification
| Power supply | AC:220±10%,50/60HZ, 3.0KW |
| Air pressure | 4~6 kgf/cm² |
| Air consumption | around 5L/min |
| Operating temperature | -20℃~+45℃ |
| Operating humidity | 30%~60% |
| Machine Dimensions(without tower light) | 1172(L) x 1385(W) x 1530 (H)mm |
| Machine Weight | Approx: around 1000Kg |
Features
1.CCD digital system, new all-optical system, uniform ring light and high brightness coaxial light source. Adopting double light source system, the brightness can be adjusted by stepless loop, which can easily identify different solder joints (including uneven solder joints), such as tin-plated, copper-plated, silver-plated, hot-air soldering, FPC, and all kinds of PCBs with different colours.
2.High precision PCB thickness adjustment, extremely reliable structure, stable XY movement. Manual adjustment can easily adapt to different PCB thickness.
3.Guideway positioning system, new pattern guideway disable, programmable flexible side clamp, for FPC, PCB warping, perform unique clamping device. Through software programming can automatically extend and withdraw unaffected PCB board warpage.
4. New innovative scraper structure design with comprehensive scraper system for improved stability and service life.
5. High-speed stencil cleaning with downward distribution cleaning structure successfully prevents clogging of openings (which has been the root cause of poor cleaning results). The length of solvent distribution can also be easily adjusted through software control.
6. New multi-functional interface, simple and clear, user-friendly. Actual temperature and humidity monitoring function.
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Precision Solder Paste Machine for Industrial 4.0 MES System Compatibility Images
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